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Nanoparticle Engineering for Chemical-Mechanical Planarization
Ungyu Paik and Jea-Gun Park
2009
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Increasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.
This book is made open access as part of the Knowledge Unlatched KU Select 2018: STEM Backlist Books
This book is made open access as part of the Knowledge Unlatched KU Select 2018: STEM Backlist Books
This book is included in DOAB.
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Keywords
- !bisacsh TEC008070
- Engineering
- KUnlatched
- Material Sciences
- Nanotechnology
- Science
- Science / Chemistry
- Science / Chemistry / Industrial & Technical
- Technology & Engineering
- Technology & Engineering / Chemical & Biochemical
- Technology & Engineering / Materials Science
- Technology, engineering, agriculture
- Technology: general issues
Links
DOI: 10.1201/9781420059137web: https://www.routledge.com/Nanoparticle-Engineering-for-Chemical-Mechanical-Planarization-Open-Access/Paik-Park/p/book/9781420059113
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