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Flexible Electronics: Fabrication and Ubiquitous Integration

Flexible Electronics: Fabrication and Ubiquitous Integration

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Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.

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Keywords

  • artificial synapses
  • bio-integrated devices
  • bottom-up approaches
  • brain-like intelligence
  • conformal design
  • design metrics
  • droplet circuits
  • dry/wet conditions
  • durability
  • electron transport
  • electronic measurements
  • epidermal electronics
  • epidermal sensors
  • feedback control
  • Flexible electronics
  • flexible organic electronics
  • hydrophobic paper
  • ionic conduction
  • island-bridge
  • liquid metal
  • long-term plasticity
  • low-cost manufacture
  • microwave photonics
  • n/a
  • nano-fabrication
  • neuromorphic computing
  • non-developable surface
  • paper electronics
  • Polyvinyl Alcohol
  • quantum computing
  • quantum tunneling effect
  • Reliability
  • soft biological tissue
  • solution electronics
  • stretchability
  • stretchable circuits
  • Stretchable electronics
  • surface plasmon-polariton (SPP)
  • temperature sensor
  • tissue adhesives
  • top-down approaches
  • tunable adhesion
  • tunnel encapsulation
  • variable optical attenuator (VOA)
  • wearable heater
  • wearable stimulators
  • wireless power

Links

DOI: 10.3390/books978-3-03897-829-9

Editions

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