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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Lindenmann, Nicole
2018
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
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Keywords
- integrierte Photonik
- optical interconnects
- optische Aufbau- und Verbindungstechnik
- photonic integrated circuits
- Photonic Wire Bonding
- silicon photonics
- Silizium-Photonik
Links
DOI: 10.5445/KSP/1000077963Editions