Feedback

X
Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

en

0 Ungluers have Faved this Work
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.

This book is included in DOAB.

Why read this book? Have your say.

You must be logged in to comment.

Rights Information

Are you the author or publisher of this work? If so, you can claim it as yours by registering as an Unglue.it rights holder.

Downloads

This work has been downloaded 36 times via unglue.it ebook links.
  1. 36 - pdf (CC BY-SA) at Unglue.it.

Keywords

  • Dünnschichtbauteil
  • electro-mechanical characterization
  • elektromechanische Charakterisierung
  • Flexible electronics
  • flexible Elektronik
  • Ink-jet drucken
  • Ink-jet printing
  • synchrotron X-ray diffraction
  • Synchrotron-Röntgenbeugung
  • thin-film devices

Links

DOI: 10.5445/KSP/1000086125

Editions

edition cover

Share

Copy/paste this into your site: