Explore
High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
Sofie Burger
2013
0 Ungluers have
Faved this Work
Login to Fave
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
This book is included in DOAB.
Why read this book? Have your say.
You must be logged in to comment.
Rights Information
Are you the author or publisher of this work? If so, you can claim it as yours by registering as an Unglue.it rights holder.Downloads
This work has been downloaded 42 times via unglue.it ebook links.
- 42 - pdf (CC BY-NC-ND) at Unglue.it.
Keywords
- cantilever bending
- damage structure
- Fatigue
- thin film
Links
DOI: 10.5445/KSP/1000034759Editions