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This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
This book is included in DOAB.
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Keywords
- algorithm convergence analysis
- algorithm efficiency analysis
- averaged model
- BJT
- compact thermal models
- computational complexity analysis
- DC–DC converter
- device thermal coupling
- diode–transistor switch
- Dual-Phase-Lag heat transfer model
- electrothermal (ET) simulation
- electrothermal model
- ferromagnetic cores
- Finite Difference Method scheme
- finite-element method (FEM)
- Grünwald–Letnikov fractional derivative
- History of engineering & technology
- IGBT
- inductors
- Krylov subspace-based model order reduction
- microprocessor
- model-order reduction (MOR)
- modelling
- multi-LED lighting modules
- multicellular power MOSFET
- Power electronics
- relative error analysis
- self-heating
- silicon carbide
- silicon carbide (SiC)
- SPICE
- Technology, engineering, agriculture
- Technology: general issues
- temperature sensors
- thermal measurements
- thermal model
- thermal phenomena
- thermal resistance
- thermal simulation algorithm
- throughput improvement
- transient thermal impedance
Links
DOI: 10.3390/books978-3-0365-0335-6Editions