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Electromagnetic Interference and Compatibility
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Recent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
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Keywords
- amplifiers
- anechoic chamber
- battery management system (BMS)
- biochar
- bulk current injection (BCI) test
- cable filtering
- capacitive and magnetic coupling
- cementitious composites
- channel capacity
- CMOS integrated circuits
- commercial current sensor
- common mode noise
- composite
- conducted emissions
- crosstalk
- DC currents
- DC–DC power converters
- dielectric permittivity
- Digital communications
- direct power injection (DPI)
- direct power injection (DPI) test
- discrete wavelet transform
- dual perforation (DP)
- eco-friendly material
- Economics, finance, business & management
- electric vehicles (EVs)
- electrical conductivity
- electromagnetic bandgap (EBG)
- Electromagnetic compatibility
- electromagnetic compatibility (EMC)
- electromagnetic interference
- electromagnetic interference (EMI)
- electromagnetic interference (EMI) suppressors
- Electromagnetic Interferences
- EMI filter design and optimization
- EMI mitigation techniques
- EMI modeling
- empirical mode decomposition
- Energy industries & utilities
- equivalent circuit
- Fourier series
- gap
- Gelatin
- hall-effect current sensors
- harmonics
- hybrid electric vehicles (HEVs)
- IC-level EMC
- impedance
- impedance balancing
- Industry & industrial studies
- Li-ion battery pack
- meander split
- microwave absorption
- nanocrystalline (NC)
- parallel-plate noise
- polyaniline
- power delivery network (PDN)
- power electronics EMC
- power/ground plane
- printed circuit board (PCB)
- relative permeability
- resonant coupling
- resonant frequency
- shielding effectiveness
- signal integrity
- sleeve ferrite cores
- snap ferrite
- split-core
- Spread Spectrum
- susceptibility of the output pin
- susceptibility to electromagnetic interference (EMI)
- Switched-Mode Power Supplies
- Technology, engineering, agriculture
- Technology: general issues
- transients
- transverse-electromagnetic (TEM) test
- waveguides
- wavelet packet transform
Links
DOI: 10.3390/books978-3-0365-0501-5Editions