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MEMS Packaging Technologies and 3D Integration
Seonho Seok (editor)
2022
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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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Keywords
- Adhesion
- Au film thickness
- Au-Au bonding
- biocompatible packaging
- Biology, Life Sciences
- capacitive micromachined ultrasound transducers (CMUT)
- chronic implantation
- crack propagation
- deflection angle
- equivalent circuit model
- fan-out wafer-level package
- fan-out wafer-level packaging (FOWLP)
- FEM
- finite difference time domain
- Finite element
- finite element analysis
- finite element method (FEM)
- fuzzy AHP
- fuzzy VIKOR
- glass substrate
- heterogeneous integration
- implantable
- Inkjet printing
- integrated nanostructure-multilayer reactive system
- low-temperature MEMS packaging
- Mathematics & science
- MCDM
- MEMS and IC integration
- MEMS resonator
- metal direct bonding
- microbump
- microelectromechanical systems (MEMS) packaging
- microsystem integration
- millimeter-wave
- multilayer reactive bonding
- n/a
- neural interface
- neural probe
- Ni/Al reactive multilayer system
- optical and electromagnetics simulations
- packaging-on-packaging
- parylene
- Pd/Al reactive multilayer system
- polymer packaging
- redistribution layers
- redundant TSV
- Reference, information & interdisciplinary subjects
- Reliability
- reliability life
- Research & information: general
- room-temperature bonding
- S-parameters extraction
- scotch tape test
- self-propagating exothermic reaction
- simulation
- spontaneous self-ignition
- stress intensity factor (SIF)
- surface activated bonding
- surface roughness
- technology evaluation
- temperature coefficient
- thermal sensors
- thermal stress
- thin film metal
- TMOS sensor
- ultrasonic bonding
- Wafer bonding
- wafer sealing
Links
DOI: 10.3390/books978-3-0365-4257-7Editions