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MEMS Packaging Technologies and 3D Integration

MEMS Packaging Technologies and 3D Integration

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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Keywords

  • Adhesion
  • Au film thickness
  • Au-Au bonding
  • biocompatible packaging
  • Biology, Life Sciences
  • capacitive micromachined ultrasound transducers (CMUT)
  • chronic implantation
  • crack propagation
  • deflection angle
  • equivalent circuit model
  • fan-out wafer-level package
  • fan-out wafer-level packaging (FOWLP)
  • FEM
  • finite difference time domain
  • Finite element
  • finite element analysis
  • finite element method (FEM)
  • fuzzy AHP
  • fuzzy VIKOR
  • glass substrate
  • heterogeneous integration
  • implantable
  • Inkjet printing
  • integrated nanostructure-multilayer reactive system
  • low-temperature MEMS packaging
  • Mathematics & science
  • MCDM
  • MEMS and IC integration
  • MEMS resonator
  • metal direct bonding
  • microbump
  • microelectromechanical systems (MEMS) packaging
  • microsystem integration
  • millimeter-wave
  • multilayer reactive bonding
  • n/a
  • neural interface
  • neural probe
  • Ni/Al reactive multilayer system
  • optical and electromagnetics simulations
  • packaging-on-packaging
  • parylene
  • Pd/Al reactive multilayer system
  • polymer packaging
  • redistribution layers
  • redundant TSV
  • Reference, information & interdisciplinary subjects
  • Reliability
  • reliability life
  • Research & information: general
  • room-temperature bonding
  • S-parameters extraction
  • scotch tape test
  • self-propagating exothermic reaction
  • simulation
  • spontaneous self-ignition
  • stress intensity factor (SIF)
  • surface activated bonding
  • surface roughness
  • technology evaluation
  • temperature coefficient
  • thermal sensors
  • thermal stress
  • thin film metal
  • TMOS sensor
  • ultrasonic bonding
  • Wafer bonding
  • wafer sealing

Links

DOI: 10.3390/books978-3-0365-4257-7

Editions

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