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Selected Papers from 2020 IEEE International Conference on High Voltage Engineering (ICHVE 2020)
Issouf Fofana (editor) and Bo Zhang (editor)
2023
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The 2020 IEEE International Conference on High Voltage Engineering (ICHVE 2020) was held on 6–10 September 2020 in Beijing, China. The conference was organized by the Tsinghua University, China, and endorsed by the IEEE Dielectrics and Electrical Insulation Society. This conference has attracted a great deal of attention from researchers around the world in the field of high voltage engineering. The forum offered the opportunity to present the latest developments and different emerging challenges in high voltage engineering, including the topics of ultra-high voltage, smart grids, and insulating materials.
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Keywords
- AC breakdown strength
- accumulative effect
- AC–DC combined voltage
- adding order
- cable accessories
- Charge Transport
- composite insulator
- contamination flashover
- creepage discharge
- critical breakdown field strength
- current transformer
- DC aging
- DC breakdown
- detection and diagnosis
- dielectric medium
- dielectric properties
- discharge channel
- discharge channel morphology characteristics
- double Schottky barrier
- electric field strength
- electro-thermal coupling
- extended Debye model
- Faster RCNN
- fault location
- Finite element
- finite element analysis
- fluoroketone
- fluoronitrile
- gas insulated switchgear
- gray information
- grounding
- hexagonal boron nitride
- high soil resistivity
- History of engineering & technology
- impulse discharge performance
- infrared image processing
- Insulation
- low pressure
- matrix pencil algorithm
- Mean-Shift algorithm
- mechanical defect
- micro and nanoparticles
- micro/nanocomposite
- n/a
- oil-film dielectric
- oil–paper insulation
- on-line monitoring system
- operating state
- optical diagnostic method
- Orientation
- OS-ELM
- pattern recognition
- point defects
- pollution flashover
- polyethylene
- power cable
- residual resistivity
- SF6
- SF6-alternative
- SF6-free
- sheath current
- smart condition diagnosis
- soil discharge
- successive impulse
- sulfur hexafluoride
- super absorbent polymer
- Technology, engineering, agriculture
- Technology: general issues
- the local arc
- thermal field
- time-domain dielectric response
- transient analysis model
- transient voltage
- trap characteristics
- traveling wave
- UHV GIL
- unsupervised learning
- UWB voltage sensing
- Vibration
- X-ray
- X-ray imaging
- X-ray imaging technology
- ZnO varistors
Links
DOI: 10.3390/books978-3-0365-6176-9Editions