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Hybrid photonic assemblies based on 3D-printed coupling structures
Yilin Xu
2023
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Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
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Keywords
- Electrical engineering
- Energy technology & engineering
- Technology, engineering, agriculture
Links
DOI: 10.5445/KSP/1000154744Editions