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Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
Tobias Kohler
2023
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The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
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Keywords
- Alkoxysilan
- Alkoxysilane
- Leistungselektronik
- Mechanical engineering & materials
- Potting Material
- Power electronics
- Primer
- Scherfestigkeit
- shear strength
- Technology, engineering, agriculture
- Vergussmasse
Links
DOI: 10.5445/KSP/1000156532Editions