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Emerging Micro Manufacturing Technologies and Applications
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This book is a reprint of the Special Issue Emerging Micro Manufacturing Technologies and Applications that was published in Micromachines. It contains eleven articles, including one Editorial, nine research papers, and one review.
This book is included in DOAB.
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Keywords
- acrylonitrile butadiene styrene (ABS)
- alloy wire
- ANCOVA regression analysis
- annealing
- anti-reflection
- bonding wire
- Bosch process
- buried hard-etch mask
- cavity-BOX
- cavity-SOI
- DBS
- deformation
- development trends
- different surface morphologies
- electrical discharge coating
- electroforming
- elongation
- Fatigue
- flex to rigid (F2R)
- foldable devices
- functionalization
- fused deposition modeling (FDM)
- general comparison
- gloss reduction
- History of engineering & technology
- hydrophobicity
- laser polishing
- low-temperature polysilicon (LTPS)
- manufacturability
- material deposition rate
- melt hydrodynamics
- MEMS
- metal structures
- microhardness
- miniaturization
- multi-beam micromachning
- multi-split electrode
- n/a
- Nanoparticles
- Numerical Simulation
- numerical study
- parametric study
- patterned BOX
- polyamide (Nylon)
- precision processing
- processing rate
- Reliability
- resistivity
- silicon nanowires
- SOI substrate
- strength
- Taguchi analysis
- Technology, engineering, agriculture
- Technology: general issues
- tempered glass
- tension
- TOPSIS
- very high frequency (VHF)
Links
DOI: 10.3390/books978-3-0365-8212-2Editions