Explore
Use of Modern Materials in Technological Processes Accompanied by Frictional Heating
0 Ungluers have
Faved this Work
Login to Fave
This reprint contains 14 articles published in the Special Issue, “Use of Modern Materials in Technological Processes Accompanied by Frictional Heating". These articles can be divided into five groups:1) Analytical modeling of the frictional heating process in systems made of homogeneous and functionally gradient materials (FGMs) [1–7];2) Numerical simulations of the temperature mode of railway brake systems [8, 9];3) Experimental studies and numerical simulations of the influence of various types of additives added to the friction material in the wet clutch disc [10, 11];4) Inverse thermal problems of friction [12];5) The influence of friction on the stress distribution in a composite containing thin elastic homogeneous inclusions, or that made of FGM [13, 14].
This book is included in DOAB.
Why read this book? Have your say.
You must be logged in to comment.
Rights Information
Are you the author or publisher of this work? If so, you can claim it as yours by registering as an Unglue.it rights holder.Downloads
This work has been downloaded 33 times via unglue.it ebook links.
- 33 - pdf (CC BY) at Unglue.it.
Keywords
- 1xBg brake configuration
- bimaterial
- braking
- ceramic
- clutch
- composite
- composites
- crack
- cylindrical layers
- finite element analysis
- Finite element method
- Friction
- friction coefficient
- friction material
- frictional heating
- functionally graded material
- functionally graded materials
- functionally gradient materials
- heat partition ratio
- History of engineering & technology
- inverse thermoelasticity problem
- jump functions
- long-term braking
- moving heat source
- nonperfect contact
- numerical model
- railway disc brake
- railway tread brake
- repetitive short-term braking
- repetitive short-term braking operation
- ribbon-like reinforcement
- stable algorithm
- stress intensity factor
- Technology, engineering, agriculture
- Technology: general issues
- temperature
- thermal sensitivity
- thermal sensitivity of materials
- thin inclusion
- tribo-couple
- unknown thermal loading
- volterra integral equation