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Diffusion Soldering for the High-temperature Packaging of Power Electronics

Aarief Syed-Khaja

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Diffusion Soldering for the High-temperature Packaging of Power Electronics

Aarief Syed-Khaja

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Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements

Stefan Stein

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Laser drop on demand joining as bonding method for electronics assembly and packaging with high thermal requirements

Stefan Stein

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