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MEMS Packaging Technologies and 3D Integration
Seonho Seok (editor)
2022
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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
This book is included in DOAB.
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