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keyword: 3D IC – 2 free books.

doab These books are included in the Directory of Open Access Books. This means that they have been peer-reviewed and are of interest to scholars.

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Advanced Interconnect and Packaging

Wensheng Zhao (editor)

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Advanced Interconnect and Packaging
Wensheng Zhao (editor)
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Thermal and Electro-thermal System Simulation 2020

Márta Rencz et al. (editors)

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Thermal and Electro-thermal System Simulation 2020
Márta Rencz et al. (editors)
No Faves
Read it Now