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keyword: ultrasonic bonding – 4 free books.

doab These books are included in the Directory of Open Access Books. This means that they have been peer-reviewed and are of interest to scholars.

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MEMS Packaging Technologies and 3D Integration

Seonho Seok (editor)

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MEMS Packaging Technologies and 3D Integration
Seonho Seok (editor)
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Science, Characterization and Technology of Joining and Welding

Meysam Haghshenas

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Science, Characterization and Technology of Joining and Welding
Meysam Haghshenas
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Additive Manufacturing Volume 2

Prashanth Konda Gokuldoss and Zhi Wang

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Additive Manufacturing Volume 2
Prashanth Konda Gokuldoss and Zhi Wang
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Alloy Design and Process Innovations

Prashanth Konda Gokuldoss and Zhi Wang

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Alloy Design and Process Innovations
Prashanth Konda Gokuldoss and Zhi Wang
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